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Mengdi Han

Assistant Professor

Peking University Boya Young Fellow

Biography

Dr. Mengdi Han is an Assistant Professor in the Department of Biomedical Engineering, College of Future Technology, Peking University. He published more than 90 SCI-indexed papers, including Nature Electronics, Nature Biomedical Engineering, Science Translational Medicine, Science Robotics, Proceedings of the National Academy of Sciences, Advanced Materials, etc. His research group aims to develop and build bioelectronics with 3D architectures. The resulting 3D bioelectronics can form conformal interfaces with soft, curvilinear biological tissues, and enable new modalities in diagnosis and therapy.

Courses

n Biomedical Sensors (UG, 3 credits)

n Basics of Bioelectronics (G, 3 credits)

Education

n 2008-2012 B.E., Electronics Science & Technology, Huazhong University of Science and Technology

n 2012-2017 Ph.D., Microelectronics and Solid-State Electronics, Peking University

n 2015-2017  Joint Ph.D., Department of Materials Science and Engineering, University of Illinois Urbana-Champaign

Experience

n 2017-2020 Postdoctoral Fellow, Querrey Simpson Institute for Bioelectronics, Northwestern University

n 2021-present Assistant Professor, Department of Biomedical Engineering, College of Future Technology, Peking University

Projects:

n Principal Investigator, National Natural Science Fund for Excellent Young Scientists Fund Program (Overseas)

n Principal Investigator, National Natural Science Foundation of China, Title: Key Techniques of Soft Pressure Sensors based on Three-Dimensional Strain Gauges

n Principal Investigator, Beijing Institute of Collaborative Innovation, Title: Soft, Multimodal Sensor Array for Digital Palpation

Representative publications:

1. Z Nie¹, JW Kwak¹, M Han*, JA Rogers*, Mechanically active materials and devices for bio-interfaced pressure sensors – a review, Advanced Materials 2023, 2205609.

2. M Han¹, X Guo¹, X Chen¹, C Liang, H Zhao, Q Zhang, W Bai, F Zhang, H Wei, C Wu, Q Cui, S Yao, B Sun, Y Yang, Q Yang, Y Ma, Z Xue, JW Kwak, T Jin, Q Tu, E Song, Z Tian, Y Mei, D Fang, H Zhang, Y Huang*, Y Zhang*, JA Rogers*, Submillimeter-scale multimaterial terrestrial robots, Science Robotics 2022, 7, eabn0602.

3. L Miao¹, Y Song¹, Z Ren, C Xu, J Wan, H Wang, H Guo, Z Xiang, M Han*, H Zhang*, Three-dimensional temporary-magnetized soft robotic structures for enhanced energy harvesting, Advanced Materials 2021, 33, 2102691.

4. J Kwak¹, M Han¹, Z Xie, HU Chung, JY Lee, R Avila, J Yohay, X Chen, C Liang, M Patel, I Jung, J Kim, M Namkoong, K Kwon, X Guo, C Ogle, D Grande, D Ryu, DH Kim, S Madhvapathy, C Liu, DS Yang, Y Park, R Caldwell, A Banks, S Xu, Y Huang, S Fatone, JA Rogers*, Soft, wireless electronic system for continuous, multimodal measurements of physiological health at the skin interface with prostheses, Science Translational Medicine 2020, 12, eabc4327.

5. M Han¹, L Chen¹, K Aras¹, C Liang, X Chen, H Zhao, K Li, NR Faye, B Sun, W Bai, JH Kim, Q Yang, Y Ma, E Song, JM Baek, Y Lee, C Liu, JB. Model, G Yang, R Ghaffari, Y Huang*, IR. Efimov*, JA. Rogers*, Catheter-integrated soft multilayer electronic arrays for multiplexed sensing and actuation during cardiac surgery, Nature Biomedical Engineering 2020, 4, 997-1009.

6. M Han¹, H Wang¹, Y Yang, C Liang, W Bai, Z Yan, H Li, Y Xue, X Wang, B Akar, H Zhao, H Luan, J Lim, I Kandela, GA Ameer, Y Zhang*, Y Huang*, JA Rogers*, Three-dimensional piezoelectric polymer microsystems for vibrational energy harvesting, robotic interfaces and biomedical implants, Nature Electronics 2019, 2, 26-35.

7. Z Yan¹, M Han¹, Y Shi, A Badea, Y Yang, A Kulkarni, E Hanson, ME Kandel, X Wen, F Zhang, Y Luo, Q Lin, H Zhang, X Guo, Y Huang, K Nan, S Jia, AW Oraham, MB Mevis, J Lim, X Guo, M Gao, W Ryu, KJ Yu, BG Nicolau, A Petronico, SS Rubakhin, J Lou, PM Ajayan, K Thornton, G Popescu, D Fang, JV Sweedler, PV Braun, H Zhang, RG Nuzzo, Y Huang, Y Zhang*, JA Rogers*, Three-dimensional mesostructures as high-temperature growth templates, electronic cellular scaffolds, and self-propelled microrobots, Proceedings of the National Academy of Sciences 2017, 114, E9455-E9464.