Assistant Professor

Peking University Boya Young Fellow

Biography

Dr. Mengdi Han is an Assistant Professor in the Department of Biomedical Engineering, College of Future Technology, Peking University. He received his B.S. degree in Huazhong University of Science and Technology in 2012 and Ph.D. degree in Peking University in 2017. He was a visiting Ph.D. student at Department of Materials Science and Engineering, University of Illinois Urbana-Champaign from 2015 to 2017. He worked as a postdoctoral fellow at Querrey Simpson Institute for Bioelectronics, Northwestern University from 2017 to 2020. He published more than 100 SCI-indexed papers, including first/corresponding author papers in Nature Electronics, Nature Biomedical Engineering, Science Translational Medicine, Science Robotics, Science Advances, PNAS, Advanced Materials, etc. His research group aims to develop advanced micromechanical bioelectronics for electronic skins, wireless biosensors and microrobotics. His research has been recognized with many awards including Microsystems & Nanoengineering Young Scientist Award (2020), MIT Technology Review Innovators Under 35 Asia Pacific (2021), iCANX Young Scientist Award (2024), and Asian Young Scientist Fellowship (2024).

Courses

n Biomedical Sensors (UG, 3 credits)

n Basics of Bioelectronics (G, 3 credits)

Education

n 2008-2012  B.E., Electronics Science & Technology, Huazhong University of Science and Technology

n 2012-2017  Ph.D., Microelectronics and Solid-State Electronics, Peking University

n 2015-2017 Joint Ph.D., Department of Materials Science and Engineering, University of Illinois Urbana-Champaign

Experience

n 2017-2020  Postdoctoral Fellow, Querrey Simpson Institute for Bioelectronics, Northwestern University

n 2021-present Assistant Professor, Department of Biomedical Engineering, College of Future Technology, Peking University

Projects:

n Principal Investigator, Asian Young Scientist Fellowship, Title: Soft, Deformable Bioelectronics

n Principal Investigator, the Emerging Engineering Interdisciplinary Project of Peking University, Title: Research and Clinical Practice of Wearable Sensors for Remote Monitoring of Heart Failure

n Principal Investigator, the National Natural Science Foundation of China, Title: Key Technologies for Miniaturized, Soft Six-Axis Force Sensor Array

n Co-Principal Investigator, the Ministry of Science and Technology of the People's Republic of China, Title: Coupling of Contact Electrification and Field Effect and Its Application in Tactile Sensing

n Principal Investigator, the Emerging Engineering Interdisciplinary Project of Peking University, Title: Manufacturing and Application of a Wireless Hemodynamic Monitoring System for Heart Failure

n Principal Investigator, the National Natural Science Fund for Excellent Young Scientists Fund Program (Overseas)

n Principal Investigator, the National Natural Science Foundation of China, Title: Key Techniques of Soft Pressure Sensors based on Three-Dimensional Strain Gauges

n Principal Investigator, the Beijing Institute of Collaborative Innovation, Title: Soft, Multimodal Sensor Array for Digital Palpation

Representative publications:

1. C Xu¹, Y Wang¹, J Zhang, J Wan, Z Xiang, Z Nie, J Xu, X Lin, P Zhao, Y Wang, S Zhang, J Zhang, C Liu, N Xue, W Zhao, M Han*, Three-dimensional micro strain gauges as flexible, modular tactile sensors for versatile integration with micro- and macroelectronics, Science Advances 2024, 10, eadp6094.

2. J Wan¹, Z Nie¹, J Xu, Z Zhang, S Yao, Z Xiang, X Lin, Y Lu, C Xu, P Zhao, Y Wang, J Zhang, Y Wang, S Zhang, J Wang, W Man, M Zhang, M Han*, Millimeter-scale magnetic implants paired with a fully integrated wearable device for wireless biophysical and biochemical sensing, Science Advances 2024, 10, eadm9314.

3. Z Xiang, H Wang, P Zhao, X Fa, J Wan, Y Wang, C Xu, S Yao, W Zhao, H Zhang, M Han*, Hard magnetic graphene nanocomposite for multimodal, reconfigurable soft electronics, Advanced Materials 2024, 36, 2308575.

4. M Han¹, X Guo¹, X Chen¹, C Liang, H Zhao, Q Zhang, W Bai, F Zhang, H Wei, C Wu, Q Cui, S Yao, B Sun, Y Yang, Q Yang, Y Ma, Z Xue, JW Kwak, T Jin, Q Tu, E Song, Z Tian, Y Mei, D Fang, H Zhang, Y Huang*, Y Zhang*, JA Rogers*, Submillimeter-scale multimaterial terrestrial robots, Science Robotics 2022, 7, eabn0602.

5. M Han¹, L Chen¹, K Aras¹, C Liang, X Chen, H Zhao, K Li, NR Faye, B Sun, W Bai, JH Kim, Q Yang, Y Ma, E Song, JM Baek, Y Lee, C Liu, JB. Model, G Yang, R Ghaffari, Y Huang*, IR. Efimov*, JA. Rogers*, Catheter-integrated soft multilayer electronic arrays for multiplexed sensing and actuation during cardiac surgery, Nature Biomedical Engineering 2020, 4, 997-1009.

6. M Han¹, H Wang¹, Y Yang, C Liang, W Bai, Z Yan, H Li, Y Xue, X Wang, B Akar, H Zhao, H Luan, J Lim, I Kandela, GA Ameer, Y Zhang*, Y Huang*, JA Rogers*, Three-dimensional piezoelectric polymer microsystems for vibrational energy harvesting, robotic interfaces and biomedical implants, Nature Electronics 2019, 2, 26-35.