Assistant Professor

Peking University Boya Young Fellow

Biography

Dr. Mengdi Han is an Assistant Professor in the Department of Biomedical Engineering, College of Future Technology, Peking University. He published more than 100 SCI-indexed papers, including Nature Electronics, Nature Biomedical Engineering, Science Translational Medicine, Science Robotics, Science Advances, PNAS, Advanced Materials, etc. His research group aims to create advanced structures, such as 3D mesostructures and magnetic structures, for bioelectronics. His research has been recognized with many awards including MIT Technology Review Innovators Under 35 Asia Pacific, and Microsystems & Nanoengineering Young Scientist Award.

Courses

n Biomedical Sensors (UG, 3 credits)

n Basics of Bioelectronics (G, 3 credits)

Education

n 2008-2012 B.E., Electronics Science & Technology, Huazhong University of Science and Technology

n 2012-2017 Ph.D., Microelectronics and Solid-State Electronics, Peking University

n 2015-2017  Joint Ph.D., Department of Materials Science and Engineering, University of Illinois Urbana-Champaign

Experience

n 2017-2020 Postdoctoral Fellow, Querrey Simpson Institute for Bioelectronics, Northwestern University

n 2021-present Assistant Professor, Department of Biomedical Engineering, College of Future Technology, Peking University

Projects:

n Co-Principal Investigator, the Ministry of Science and Technology of the People's Republic of China, Title: Coupling of Contact Electrification and Field Effect and Its Application in Tactile Sensing

n Principal Investigator, the Emerging Engineering Interdisciplinary Project of Peking University, Title: Manufacturing and Application of a Wireless Hemodynamic Monitoring System for Heart Failure

n Principal Investigator, the National Natural Science Fund for Excellent Young Scientists Fund Program (Overseas)

n Principal Investigator, the National Natural Science Foundation of China, Title: Key Techniques of Soft Pressure Sensors based on Three-Dimensional Strain Gauges

n Principal Investigator, the Beijing Institute of Collaborative Innovation, Title: Soft, Multimodal Sensor Array for Digital Palpation

Representative publications:

1. J Wan¹, Z Nie¹, J Xu, Z Zhang, S Yao, Z Xiang, X Lin, Y Lu, C Xu, P Zhao, Y Wang, J Zhang, Y Wang, S Zhang, J Wang, W Man, M Zhang, M Han*, Millimeter-scale magnetic implants paired with a fully integrated wearable device for wireless biophysical and biochemical sensing, Science Advances 2024, 10, eadm9314.

2. Z Xiang, H Wang, P Zhao, X Fa, J Wan, Y Wang, C Xu, S Yao, W Zhao, H Zhang, M Han*, Hard magnetic graphene nanocomposite for multimodal, reconfigurable soft electronics, Advanced Materials 2023, 2308575.

3. Z Nie¹, JW Kwak¹, M Han*, JA Rogers*, Mechanically active materials and devices for bio-interfaced pressure sensors – a review, Advanced Materials 2022, 2205609.

4. M Han¹, X Guo¹, X Chen¹, C Liang, H Zhao, Q Zhang, W Bai, F Zhang, H Wei, C Wu, Q Cui, S Yao, B Sun, Y Yang, Q Yang, Y Ma, Z Xue, JW Kwak, T Jin, Q Tu, E Song, Z Tian, Y Mei, D Fang, H Zhang, Y Huang*, Y Zhang*, JA Rogers*, Submillimeter-scale multimaterial terrestrial robots, Science Robotics 2022, 7, eabn0602.

5. M Han¹, L Chen¹, K Aras¹, C Liang, X Chen, H Zhao, K Li, NR Faye, B Sun, W Bai, JH Kim, Q Yang, Y Ma, E Song, JM Baek, Y Lee, C Liu, JB. Model, G Yang, R Ghaffari, Y Huang*, IR. Efimov*, JA. Rogers*, Catheter-integrated soft multilayer electronic arrays for multiplexed sensing and actuation during cardiac surgery, Nature Biomedical Engineering 2020, 4, 997-1009.

6. M Han¹, H Wang¹, Y Yang, C Liang, W Bai, Z Yan, H Li, Y Xue, X Wang, B Akar, H Zhao, H Luan, J Lim, I Kandela, GA Ameer, Y Zhang*, Y Huang*, JA Rogers*, Three-dimensional piezoelectric polymer microsystems for vibrational energy harvesting, robotic interfaces and biomedical implants, Nature Electronics 2019, 2, 26-35.